Advanced wireless requirements for reconfigurable transceivers translate into the need for novel highly integrated microelectronic devices and modules to minimize power use, size and cost. To achieve circuit integration of the order of subsystem or system on a chip or multichip module will require that circuit design issues be addressed at the device, cell, macrocell and system level. Specific topics include the exploration and development of emerging technologies for broadband wireless including, gallium arsenide and silicon germanium semiconductor components for microwave receivers, transmitters and mixed analog/digital functions, high speed ASICs for broadband systems and FPGA technology for baseband and large scale parallel signal processing.

Further Information:

Valek Szwarc
Manager, Integrated Electronics
Tel: (613) 998-2089
Fax: (613) 990-8369
E-mail: valek.szwarc@crc.gc.ca