The latest generation of wireless communications technology calls for innovative microelectronic design, with operations integrated on a chip or multichip module in order to improve performance and minimize power, size and cost.  The CRC has been investigating the design methodology necessary to develop these system-on-package designs, which incorporate embedded passive and active components in multi-layer substrates.  The resulting circuitry could be used in RF front ends operating at microwave and millimeter wave frequencies for a broad range of applications.

In order to achieve circuit integration within these chip or multichip modules, circuit design must be addressed at the level of devices, cells, macrocells and systems.  Emerging technologies in this field include the use of gallium arsenide and silicon germanium semiconductor components for broadband wireless applications.  Researchers at the CRC are examining the advantages of such materials in microwave receivers, transmitters and mixed analog/digital functions, high speed ASICs for braodband systems and FPGA technology for baseband and large scale parallel signal processing.

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Low Temperature Co-Fired Ceramic Technology